The Journal of Electrostatics is the leading forum for publishing research findings that advance knowledge in the field of electrostatics. We invite submissions in the following areas:
Electrostatic charge separation processes: Fundamental science behind how materials (solid or liquid) accumulate electrostatic charge, by triboelectric, induction, conduction, corona and electrical double layer charging, or other mechanisms. Electrostatic charge dissipation and neutralization. Space charge in solid dielectrics. Electrets. Methods to control charging. Static measurement techniques (charge, surface potential, electric field).
Electrostatic manipulation of particles, droplets, and biological cells: Electrostatic forces on particles, including electrophoresis, dielectrophoresis and electrorotation. Applications, including electrostatic precipitators, separators, coating processes, and electrophotography. Electrostatic issues in fluidized beds and other solids handling processes. Biological/medical applications including control of biological cells and pharmaceutical powders. Microfluidics and Microelectromechanical Systems (MEMS). Coupled problems (thermal, flow, stress) with essential contribution of electrostatic phenomena.
Electrostatically driven or controlled fluid flow: Corona generated secondary electrohydrodynamic flow. Boundary layer control. Electrohydrodynamic pumping. Electro-rheology. Electrospinning and electrospraying. DC and AC Electroosmosis. Electrowetting. Applications including materials processing, thermal management, and flow control.
Electrostatics in the gas phase: Fundamental science of plasmas. Corona and dielectric barrier discharges. Electrical breakdown. Applications of plasma technologies, including environmental remediation of gas and liquid streams. Electrostatic discharges from charged surfaces - fundamentals, prevention, safety issues. Electrostatic phenomena in atmospheres, including lightning.
All submissions to the journal must be submitted online at http://ees.elsevier.com/elstat/.
For more information about submission: